Model 6400 performs cold Flip Chip, hot processes for MCM, Eutectic Ultrasonic assemblies. Manual die attach.
Besi offers a wide range of die attach systems based on leading- edge technology. To achieve high yield sophisticated heating cooling mechanisms are employed. These differences are entirely dependent on the desired application of the tectic die attach is a highly controlled die attach process for high reliability, high accuracy requirement devices. Manual die attach. Flexible, fully automatic die attach system controlled by user friendly Windows XP® based software. West· Bond manufactures wire bonders epoxy die attach, die attach, die bonders pull tester for the semiconductor industry. It is equipped with a vacuum holder bondhead with double function for epoxy die- placement. The offering includes multi- chip bonders for advanced packaging stacked die bonders , high precision flip chip bonders for mass production, epoxy , soft solder bonders die sorting equipment.
If you are looking for a challenging and exciting career in the world of. If two die are being placed side- by- side the same procedure can be used but a larger diameter hot air gun nozzle centered over both die must be used.
This process can take on many forms and can be applied in many different ways. The system is available either installed on its own bench or in " Table- Top" configuration ( without bench).